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 Igloo 5760 Series |
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| Intel CPU Clock Speed (max.) |
Intel LGA775
• Core™2 Processor (Up to E8600/3.33 GHz/65W)
• Core™2 Extreme Processor (Up to QX9650/3.0 GHz/130W)
• Core™2 Quad Processor (Up to Q9650/3.0 GHz/95W)
• Pentium® D Processor (Up to 3.6 GHz/130W)
• Pentium® Processor Extreme Edition (Up to 965/3.73 GHz/130W)
• Pentium® Processor (Up to E6500/2.93 GHz/95W)
• Pentium® 4 Processors (Up to 3.8 GHz/115W)
• Pentium® 4 Processor Extreme Edition (Up to 3.73 GHz/115W)
• Celeron® Processor Family (Up to 3.6 GHz/65W)
Intel LGA1156
• Core™ i5 Processor (Up to I5-750/2.66 GHz/95W)
Intel LGA1366
•Core™ i7 Processor (Up to I7-960/3.2 GHz/130W) |
| AMD CPU Clock Speed (max.) |
• Athlon II X3 (Up to 2.9 GHz/95W/AM3)
• Athlon™ II X4 (Up to 2.8 GHz/95W/AM3)
• Phenom™ II X4 (Up to 3.4 GHz/140W/AM3, AM2+)
• Phenom™ II X3 (Up to 2.8 GHz/95W/AM3)
• Phenom™ II X2 (Up to 3.1 GHz/80W/AM3)
• Phenom™ X4 (Up to 2.6 GHz/140W/ AM2+)
• Phenom™ X3 (Up to 2.5 GHz/95W/ AM2+, 940)
• Athlon™ II X2 (Up to 3 GHz/65W/ AM3)
• Athlon™ X2 (Up to 3.2 GHz/125W/ AM2, AM2+, 939)
• Athlon™ (Up to 2.8 GHz/89W/ AM2, 939, 754)
• Sempron™ (Up to 2.7 GHz/62W/ AM2, AM3, 754) |
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| Model |
Igloo 5760 |
| CPU Compatibility |
1) Intel LGA775, 1156 (i3, i5, i7) and LGA1366(i7)
2) AMD AM2, AM2+ and AM3 |
| Cooler Dimension (mm) |
96(W) x 128(L) x 90(H) |
| Cooler Weight (grams) |
350 |
| Fan Bearing Type |
Entering Bearing |
| Fan Rated Voltage |
DC 12 V |
| Fan Dimension (mm) |
92 x 92 x 25 |
| Fan Speed (RPM) |
800 (±300 rpm)~2000 (±10%) |
| Fan Air Flow (CFM) |
40 |
| Fan Power Consumption (Watt) |
3.12(Max) |
| Fan Operating Voltage (Volt) |
6.0~13.8 |
| Fan Noise (dBA) |
27 |
| Interface Material |
High Efficiency Thermal Compound |
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【5760 Efficiency Description】 |
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Heat-pipe cooler is a kind of complex cooling system, where every parameter influences the thermal performance. The important restriction for heat pipe is the filling ratio (F.R) of working fluid. Some heat-pipes show lowest thermal resistance in less thermal design power which is called maximum heat capacity of heat-pipe. After the thermal design power gets over the maximum heat capacity, the thermal resistance starts to rise since the radiator is not powerful enough to cool down the vapor of the cooling end, hence the working fluid can’t return to the evaporator smoothly.
Igloo 5760 use copper base with mirror surface to reduce the contact resistance between CPU and cooler; high precise inserted fin plus 9 cm bullet axial fan are used to be the high efficiency radiator to enhance the thermal cycle of heat-pipe; three 8 mm diameter heat-pipes are used to carry heat from evaporator to radiator since 8mm heat-pipe have larger thermal capacity than 6 mm. The test results show Igloo 5760 delivers better thermal performance (lower thermal resistance) in higher thermal design power, and the CPU temperatures are not over than 79°C when the room temperatures are controlled between 23~25°C.
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